Additionalinformation

Additional Information

Renesas is an embedded semiconductor solution provider driven by its Purpose, To Make Our Lives Easier. With a global team of over 21,000 engineers and problem solvers in more than 30 countries, we offer the opportunity to work on world‑leading technology for Automotive, Industrial, Infrastructure, and IoT, shaping a safer, healthier, greener, and smarter future.

At Renesas, TAGIE is our culture, grounded in being Transparent, Agile, Global, Innovative, and Entrepreneurial. It shapes how we work, grow and deliver on our purpose together. This collaborative spirit and mindset drive our semiconductor technology to transform industries and impact millions of lives.

We believe in rewarding our employees with a competitive benefits package alongside their salary. More information will be provided during the hiring process.

Are you ready to join our team and shape the future with us?

Renesas Electronics is an equal opportunity and affirmative action employer, committed to supporting diversity and fostering a work environment free of discrimination on the basis of sex, race, religion, national origin, gender, gender identity, gender expression, age, sexual orientation, military status, veteran status, or any other basis protected by law. For more information, please read our Diversity & Inclusion Statement.

Companydescription

Company Description

Jobdescription

Job Description

请求职者投递中文与英文简历

• Own and define complex power electronics system architectures (1 - 250 kW) that meet electrical performance, reliability, safety, scalability, and cost requirements for Infrastructure and Server/Datacenter applications.
• Establish the long-term technical vision, architecture principles, and reusable platform strategy for next-generation power delivery solutions.
• Lead system-level trade-off studies and drive data-based architectural decisions regarding power density, efficiency, cost, reliability, manufacturability, and time to market.
• Develop and approve system specifications, design methodologies, and technical requirements, ensuring compliance with applicable standards and regulatory requirements.
• Influence Renesas product and technology roadmaps by identifying portfolio gaps, defining differentiated system value propositions, and translating customer and market needs into product requirements.
• Break down large and complex power electronic systems into modular, scalable, and reusable subsystems that meet the efficiency, power density, serviceability, and availability requirements of modern communications and datacenter infrastructure.
• Guide modelling and simulation of complex power electronics systems in MATLAB Simulink and other appropriate system and circuit simulation environments.
• Provide technical leadership for multiple Proof-of-Concept and reference-design programs, from architecture and schematic implementation through system validation, documentation, and customer enablement.
• Serve as a recognized technical authority and escalation point for critical architectural, integration, and customer issues.
• Lead cross-functional technical reviews, manage architectural risks and dependencies, and align global engineering resources, program priorities, timelines, and budgets.
• Monitor market, standards, and technology trends and shape both solution and IC roadmaps for Datacenter and Infrastructure power systems, including voltage regulators, power-supply controllers, gate drivers, and discrete power switches.
• Build strategic relationships with key customers, ecosystem partners, external vendors, and industry bodies to accelerate solution adoption and strengthen Renesas technical leadership.
• Mentor senior engineers and architects, raise engineering standards, and foster systematic knowledge sharing across hardware, software, systems, applications, marketing, sales, and business-development teams.

Qualifications

• MSEE is required; PhD is preferred, with 12+ years of relevant experience in power-system and power-electronics architecture, design, and development across the 1 - 250 kW range.
• Sustained record of technical leadership and successful delivery of multiple complex power-electronics platforms from concept and architecture through physical prototype validation, productization, and customer adoption.
• Recognized expertise in electrical engineering fundamentals, system architecture, and structured problem solving, with the judgment to make high-impact decisions under technical and business constraints.
• Demonstrated ability to lead feasibility and trade-off studies comparing electrical performance, reliability, power density, Bill of Materials (BOM), manufacturing complexity, and total solution cost.
• Expert knowledge of power-conversion topologies (AC-DC, inverter, isolated DC-DC converters, LDO, and switch-mode topologies such as buck, boost, and buck-boost), magnetics, control theory, thermal design, protection, and discrete power devices (MOSFET, IGBT, GaN, SiC).
• Advanced proficiency with power-electronics and system simulation tools (e.g. MATLAB Simulink, SIMetrix/Simplis, SPICE, etc.) and the ability to establish modelling practices used by broader engineering teams.
• Exceptional communication, executive presentation, and influencing skills, with demonstrated success aligning customers and worldwide cross-functional groups including FAEs, Sales, Power IC design teams, Hardware and Software engineers, Product Marketing Managers, and Business Development.
• Deep experience in power-supply architectures for communication infrastructure, datacenters, traditional servers, and AI servers; direct engagement with hyperscale customers or platform partners is strongly preferred.
• Hands-on understanding of schematic design, PCB layout, thermal management, safety, and EMC/EMI mitigation for high-power applications (1 - 250 kW), sufficient to guide reviews and resolve critical implementation issues.
• Substantial experience designing power-electronics systems using wide-bandgap devices, including GaN and SiC, and evaluating their system-level value and implementation trade-offs.
• Evidence of broader technical impact—such as patents, publications, standards participation, conference contributions, architecture methodologies, or reusable platform innovations—is preferred.
• Demonstrated mentorship of senior technical staff and ability to lead through influence across organizational and geographic boundaries.